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Rigaku | XRD Stress Analysis

Automate II
Automate II


Micro-area X-ray residual stress measurement system
Highly accurate micro area residual stress with both iso- and side-inclination methods

Residual stress may be created during the manufacturing process of a material, or it may accumulate in a structure over many years in operation. In either case, this stress can have a serious negative effect on a product's quality, durability and lifetime. Accurate detection of residual stress is an important element of the quality control process and helps predict the service lifetime of products.

In the past, if you wanted to make highly accurate residual stress measurements, you had to use an R&D diffractometer because of the accuracy of the goniometer. However this restricts the weight and size of the samples you can measure. On the other hand, dedicated laboratory and factory-floor residual stress analyzers suffer from reduced accuracy due to the nature of their mechanical designs, while, in their favor, they have the flexibility of measuring large and heavy parts.

With the AutoMATE II, you now have the best of both worlds. Large and heavy parts (30 kg with standard manual Z stage; 20 kg with optional automated XYZ stage) can be measured with high accuracy. This is possible because the X-ray source and detector arm are mounted on a highly accurate two-axis goniometer that can position them relative to the measurement site and perform scans with an accuracy of 0.1 microns when using the automated XYZ stage.

The most advanced new feature of the AutoMATE II lies in an innovative new X-ray detector. The detector used in the AutoMATE II is the D/teX Ultra1000, an electronic Si strip detector that has high dynamic range, high sensitivity, and good energy resolution, as well as not requiring any consumable gas.


  • Highly accurate goniometer allows for true micro-area residual stress measurement.
  • Automatic mapping measurements with teaching function.
  • Large and heavy samples are measured with high accuracy.
  • An X-ray radiation enclosure with interlock system automatically locks the enclosure door when the X-ray shutter is open.
  • The measurement position is adjusted by 
a CCD camera equipped with a microscope having a zoom function.
  • The two-axis goniometer system allows for both iso-inclination 
and side-inclination methods automatically without readjustment of the sample position.

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    SmartSite RS
    Portable stress analyzer

    Non-destructive portable stress analyzer for field and indoor use
    The SmartSite RS is the world’s smallest portable stress analyzer that is especially designed for field analysis. It enables to characterize residual stress of metal parts ranging from large construction projects to individual products, e.g. bridges, maritime vessels, aircraft, aerospace equipment, pipelines, heavy machinery and automobiles.

    The world’s smallest instrument design
    The world’s smallest measurement head has dimension of 114(W) x 248(D) x 111(H) mm and weights 3 kg. It enables to measure residual stress of inner surface of 200 mmφ bore.

    Rapid & easy data acquisition
    High-speed two-dimensional (2-D) semiconductor detector accelerates the data acquisition time and accuracy of the date. Residual stress is measured by 60 seconds or less in most of cases. 1-click operation thanks to pre-define measurement and sample parameters.

    Remote operation through a tablet PC and Wi-Fi
    The instrument is remotely controlled by a table PC equipped with Wi-Fi communication. This design is especially useful if the measurement must be performed in a hazardous area or where access is limited.

    No on-site utilities required
    The device is operated by either an integrated battery or AC 100-240 V supplied through a wall socket. The integrated affords up to 100 measurements before recharging. It also doesn’t require any other utilities, like cooling water. Therefore, there is no need to prepare any special on-site utilities.


  • The world’s smallest head unit has dimensions of 114(W) x 248(D) x 111(H) mm and weighs 3 kg. It allows the measurement of residual stress from the inner surface of a 200 mmφ bore.
  • High-speed two-dimensional (2D) semiconductor detector accelerates the data acquisition. Residual stress is measured in 60 seconds (or less in most cases).
  • The instrument is remotely controlled by a table PC equipped with Wi-Fi communication.
  • Battery operated with an exchangeable battery. There is no need to prepare utilities on-site, e.g. cooling water and electricity.
  • 1-click operation thanks to pre-define measurement and sample parameters.
  • Easy setup using integrated three-dimensional (3D) sensors and indicators displayed on table PC.
  • Easy positioning using the integrated CCD camera, LASER marker and white LED for illumination in low light environments.
  • Calibration is easily done with the included calibration standards. The calibration history is recallable at any time to ensure measurement traceability.

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